University of Hartford dean to speak at Fairfield University School of Engineering event about technology and innovation

University of Hartford dean to speak at Fairfield University School of Engineering event about technology and innovation

Image: Lou Manzione Lou Manzione, Ph. D., dean of the College of Engineering, Technology and Architecture at the University of Hartford, will speak at Fairfield University about the potential for universities to be greater innovators, on Tuesday, March 27, at 7 p.m.

Free and open to the public, the talk, "Comparing Innovation and Technology Transfer in Industry and the Academy," will take place in the Dolan School of Business. Dr. Manzione will focus on the significant differences between the culture of invention and technology transfer in American industry versus American higher education.

Both of these have and will continue to provide important competitive advantage to the nation and be the fountains of wealth creation and employment growth, event organizers said. However, the culture and the support structure for innovation and commercialization are very different with universities at a distinct disadvantage in the processes to convert intellectual assets into economic value.

Douglas Lyon, Ph.D., professor of computer engineering at Fairfield, said, "Dr. Manzione will present his observations of how the great corporate research labs were so effective in providing the nation with a steady stream of revolutionary breakthroughs, and how universities can learn from this model and step up to assuming this mantle of innovation and commercial impact that the nation now requires of them."

To register, visit https://docs.google.com/spreadsheet/viewform?formkey=dDZkV3NSd3VkVGVLRm9tamtWVzRJTXc6MA .

Dr. Manzione had a long career with Bell Labs Research. He was the founding executive director of the Bell Labs Ireland division near Dublin that was focused on product realization research and supply chain technologies. A pioneer in the packaging of microelectronic devices, he wrote the first book on plastic packaging of computer chips, now used for more than ninety percent of the world's integrated circuits. He is the chair of the newly formed Connecticut Engineering Deans Council.

The event is co-sponsored by Fairfield's School of Engineering and the Inventors Association of Connecticut. For more information about the School of Engineering, visit http://www.fairfield.edu/soe/index.html .

Posted On: 03-15-2012 11:03 AM

Volume: 44 Number: 230