Fairfield University announces Summer Scholars, a new two-week, for-credit college academic/residential experience for talented rising high school juniors and seniors. High school students learn alongside college students, broadening their knowledge in a host of courses from biology, sociology, international studies and communication to film, music and studio art.
Summer Scholars, which will run from July 8 through 20, offers high school students a chance to get a taste for what college is really like by taking a three-credit course and living in a residence hall, taking advantage of all Fairfield's safe and scenic 200-acre campus has to offer. In addition, students will attend workshops on topics such as the college search and application process and meet with the assistant dean of the College of Arts and Sciences to discuss their academic progress.
"Fairfield University's Summer Scholars Program has been designed specifically for talented high school students who want a comprehensive taste of what college life is like at our beautiful and dynamic campus," said Aaron Perkus, associate dean of University College at Fairfield University. "Students will live in our residence halls, eat at our facilities, take our credit classes, and participate in an array of enrichment and recreational activities. Faculty and staff will develop an individual relationship with each participant to ensure we are meeting the needs of the whole person."
Program highlights:
Enrolled students may take one, three-credit course that meets three hours each weekday for the two-week period. Students will prepare for their course by completing about five hours of pre-work online prior to the beginning of class.
Course options are varied and there are no prerequisites. Students may choose from:
The Summer Scholars Program is open to qualified high school students in the classes of 2013 and 2014. Students must have a GPA of 3.2 or higher. For more information or to apply before the June 15 deadline, visit www.fairfield.edu/summerscholars .
Posted On: 03-12-2012 11:03 AM
Volume: 44 Number: 210